Diffusion & Oxidation

Diffusion and oxidation are two key processes in semiconductor manufacturing that are used to create specific regions and features in the semiconductor material.

  • Diffusion: Diffusion is the process by which dopant atoms are introduced into the semiconductor material to create regions of controlled conductivity. This process involves heating the semiconductor material to high temperatures and introducing a gas containing the dopant atoms, which then diffuse into the semiconductor lattice.
  • Oxidation: Oxidation is the process by which a thin layer of oxide is grown on the surface of the semiconductor material. This process is typically carried out by exposing the material to an oxidizing gas, such as oxygen or water vapor, at high temperatures. The oxide layer can serve as a protective layer, a mask for subsequent etching or implantation steps, or as a gate dielectric in MOS devices.

Both diffusion and oxidation are critical processes in semiconductor manufacturing, and precise control over these processes is essential for ensuring high device performance and yield. In addition, other processes, such as photolithography and etching, are often used in conjunction with diffusion and oxidation to create the desired device features and structures. Overall, semiconductor manufacturing is a highly complex and carefully controlled process that requires a deep understanding of the underlying physics and chemistry involved.